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rev. b.13 - mar., 2004 hpl1117 1 1a low dropout fast response positive adjustable regulator and fixed 1.8v, 2.5v, 2.85v, 3.3v and 5v ? copyright hipac semiconductor, inc. www.hipacsemi.com ? ? ? ? ? guaranteed output voltage accuracy within 2% ? ? ? ? ? fast transient response ? ? ? ? ? guaranteed dropout voltage at multiple currents ? ? ? ? ? load regulation : 0.1% typ. ? ? ? ? ? line regulation : 0.03% typ. ? ? ? ? ? low dropout voltage : 1.1v typ. at i out =1a ? ? ? ? ? current limit : 1a typ. at t j =25 c ? ? ? ? ? on-chip thermal limiting : 150 c typ. ? ? ? ? ? adjustable output : 1.25~10.7v ? ? ? ? ? standard 3-pin to-220, to-252, to-263 and sot-223 power packages features applications ? ? ? ? ? active scsi terminators ? ? ? ? ? low voltage logic supplies ? ? ? ? ? post regulator for switching power supply general description the hpl1117 is a low dropout three-termin al adjust- able regulators with 1a output current capability. in order to obtain lower dropout voltage and faster tran- sient response, which is critical for low voltage ap- plications , the hpl1117 has been optimized. the device is available in an adjustable version and fixed output voltages of 1.8v, 2.5v, 2.85v, 3.3v and 5v. the output available voltage range of an adjustable version is from 1.25~10.7v with an input supply be- low 12v. dropout voltage is guaranteed at a maxi- mum of 1.3v at 1a. current limit is trimmed to ensure specified output current and controlled short-circuit current. on-chip thermal limiting provides protection against any combination of overload that would cre- ate excessive junction temperatures. the hpl1117 is available in the industry standard 3-pin to-220, to- 252, to-263, and the low profile surface mount sot- 223 power packages which can be used in applica- tions where space is limited. pin description front view for to-252 tab is v out 1 2 3 v in v out adj/gnd front view for to-263 1 2 3 v in v out adj/gnd tab is v out front view for to-220 1 2 3 v in v out adj/gnd
rev. b.13 - mar., 2004 hpl1117 2 ? copyright hipac semiconductor, inc. www.hipacsemi.com package code f : to-220 g : to-263 u : to-252 v : sot-223 temp. range c : 0 to 70 c handling code tu : tube tr : tape & reel voltage code 18 : 1.8v 25 : 2.5v 28 : 2.85v 33 : 3.3v 50 : 5v blank : adjustable version lead free code l : lead free device blank : orginal device ordering and marking information pin description (cont.) tab is v out out 1 2 3 adj/gnd in front view for sot-223
rev. b.13 - mar., 2004 hpl1117 3 ? copyright hipac semiconductor, inc. www.hipacsemi.com symbol parameter rating (n o t e ) unit v i input voltage hpl1117, hpl1117-50, hpl1117-33 hpl1117-25, hpl1117-18, hpl1117-28 15 9 v t j operating junction temperature range control section power transistor 0 to 125 0 to 150 electrical characteristics hpl1117 symbol parameter test conditions min. typ. max. unit v ref reference voltage 10ma absolute maximum ratings note : the values here show the absolute maximum rating, and for normal usage please refer the test condition in electrical characteristics table.
rev. b.13 - mar., 2004 hpl1117 4 ? copyright hipac semiconductor, inc. www.hipacsemi.com electrical characteristics (cont.) hpl1117 symbol parameter test conditions min. typ. max. unit i out =100ma (note2) 1 1.1 v d dropout voltage i out =500ma (note2) i out =1a (note2) 1.05 1.1 1.2 1.3 v i limit current limit (v in -v out )=5v, t j =25 ?
rev. b.13 - mar., 2004 hpl1117 5 ? copyright hipac semiconductor, inc. www.hipacsemi.com v in 10 ? ? 10 application circuits * c1 improves ripple rejection. x c should be approximately equal to r1 at ripple frequency * needed if device is far from filter capacitors 1.25v to 10.7v adjustable regulator impro ving ripple rejection v in 10 100 ? block diagram current limit voltage regulation thermal protection v in v out adj/gnd
rev. b.13 - mar., 2004 hpl1117 6 copyright hipac semiconductor, inc. www.hipacsemi.com 0 1 2 3 4 5 6 -20 30 80 130 180 -0.05 0 0.05 0.1 0.15 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 -100 100 300 500 700 900 -0.03 -0.02 -0.01 0 0.01 0.02 . typical characteristics input voltage (v) time ( p s) load transietn response output current (a) time ( p s) line transient response c in =10 p f c out =10 p f tantalum v in =5v c in =10 p f c out =10 p f tantalum i out =0.1a hpl1117-33 hpl1117-33 0 1 2 3 4 5 6 0123456789 hpl11 17-33 0.9 0.95 1 1.05 1.1 1.15 1.2 1.25 0 0.2 0.4 0.6 0.8 1 dropout voltage vs. output current output current (a) dropout voltage (v) output voltage (v) output voltage vs. input voltage input voltage (v)
rev. b.13 - mar., 2004 hpl1117 7 ? copyright hipac semiconductor, inc. www.hipacsemi.com 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 -50 -25 0 25 50 75 100 125 hpl1117-33 hpl1117-33 1 1.2 1.4 1.6 1.8 2 2.2 2.4 5 7 9 11 13 0 1 2 3 4 5 6 024681012 typical characteristics cont. current limit (a) input voltage (v) output voltage vs. temperature temperature (c) output voltage (v) output voltage (v) output voltage vs. temperature temperature (c) input current vs. input voltage input current (ma) input voltage (v) current limit vs. input voltage 1.6 1.7 1.8 1.9 2 2.1 2.2 2.3 2.4 2.5 2.6 -50 -25 0 25 50 75 100 125
rev. b.13 - mar., 2004 hpl1117 8 copyright hipac semiconductor, inc. www.hipacsemi.com 4.7 4.8 4.9 5 5.1 5.2 5.3 -50 -25 0 25 50 75 100 125 hpl1117-33 2 3 4 5 6 7 8 -50 -25 0 25 50 75 100 125 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 -50 0 50 100 150 -100 +0 -90 -80 -70 -60 -50 -40 -30 -20 -10 10 200k 20 50 100 200 500 1k 2k 5k 10k 20k 50k 6 6 6 6 6 typical characteristics cont. input current (ma) temperature (c) current limit vs. temperature temperature (c) current limit (a) psrr (db) psrr vs. frequency frequency (hz) output voltage vs. temperature output voltage (v) temperature (c) input current vs. tmeperature v in -v out =5v c adj =22 p f i out =0.1a vripple=1v p - p v in -v out >=vdropout v in -v out >=3v hpl1117-33 hpl1117-33
rev. b.13 - mar., 2004 hpl1117 9 ? copyright hipac semiconductor, inc. www.hipacsemi.com typical characteristics cont. adjustable pin current vs. temperature adjustable pin current ( hpl1117-adj
rev. b.13 - mar., 2004 hpl1117 10 copyright hipac semiconductor, inc. www.hipacsemi.com the hpl1117 requires an output capacitor to maintain stability and improve transient response. proper ca- pacitor selection is important to ensure proper operation. the hpl1117 output capacitor selection is dependent upon the esr (equivalent series resistance) of the output capacitor to maintain stability. when the output capacitor is 10uf or greater, the output capaci- tor should have an esr less than 1 : this will improve transient response as well as promote stability. a low- esr solid tantalum capacitor works extremely well and provides good transient response and stability over temperature. v in hpl1117 out in adj r1 r2 rp parasitic line resistance connect r1 to case connect r2 to load r l output voltage v in hpl1117 out in adj v ref r1 r2 v out i adj 60 p a application information input capacitor output capacitor the hpl1117 develops a 1.25v reference voltage be- tween the output and the adjust terminal. by placing a resistor between these two terminals, a constant current is caused to flow through r1 and down through r2 to set the overall output voltage. normally this current is chosen to be the specified minimum load current of 10ma. for fixed voltage devices r1 and r2 are included in the device. load regulation when the adjustable regulator is used. load regula- tion will be limited by the resistance of the wire con- necting the regulator to the load. the data sheet speci- fication for load regulation is measured at the output pin of the device. best load regulation is obtained when the top of the resistor divider (r1) is tied di- rectly to the output pin of the device, not to the load. for fixed voltage devices the top of r1 is internally connected to the output, and the ground pin can be connected to low side of the load. if r1 were con- nected to the load, rp is multiplied by the divider ratio, the effective resistance between the regulator and the load would be: an input capacitor of 10 p f or greater is recommended. tantalum, or aluminum electrolytic capacitors can be used for bypassing. larger val- ues will improve ripple rejection by bypassing the in- put to the regulator. v out = v ref (1+ )+i adj r2 r2 r1 figure 1. basic adjustable regulator figure 2. connections for best load regulation rp x (1+ ), rp = parasitic line resistance r2 r1
rev. b.13 - mar., 2004 hpl1117 11 ? copyright hipac semiconductor, inc. www.hipacsemi.com output capacitor (cont.) application information (cont.) aluminum electrolytics can also be used, as long as the esr of the capacitor is <1 ? ? ? ?
rev. b.13 - mar., 2004 hpl1117 12 ? copyright hipac semiconductor, inc. www.hipacsemi.com application information (cont.) the thermal resistance for each application will be affected by thermal interactions with other compo- nents on the board. some experimentation will be necessary to determine the actual value. the power dissipation of hpl1117 is equal to : p d = (v in - v out ) x i out maximum junction temperature is equal to : t junction = t ambient + (p d x
rev. b.13 - mar., 2004 hpl1117 13 ? copyright hipac semiconductor, inc. www.hipacsemi.com package information to-220 ( reference jedec registration to-220) q d r e f j1 e e1 b1 l1 a c b h1 l millimeters inches dim min. max. min. max. a 3.56 4.83 0.140 0.190 b1 1.14 1.78 0.045 0.070 b 0.51 1.14 0.020 0.045 c 0.31 1.14 0.012 0.045 d 14.23 16.51 0.560 0.650 e 2.29 2.79 0.090 0.110 e1 4.83 5.33 0.190 0.210 e 9.65 10.67 0.380 0.420 f 0.51 1.40 0.020 0.055 h1 5.84 6.86 0.230 0.270 j1 2.03 2.92 0.080 0.115 l 12.7 14.73 0.500 0.580 l1 3.65 6.35 0.143 0.250 r 3.53 4.09 0.139 0.161 q 2.54 3.43 0.100 0.135
rev. b.13 - mar., 2004 hpl1117 14 ? copyright hipac semiconductor, inc. www.hipacsemi.com package informaion to-252( reference jedec registration to-252) millimeters inches dim min. max. min. max. a 2.18 2.39 0.086 0.094 a1 0.89 1.27 0.035 0.050 b 0.508 0.89 0.020 0.035 b2 5.207 5.461 0.205 0.215 c 0.46 0.58 0.018 0.023 c1 0.46 0.58 0.018 0.023 d 5.334 6.22 0.210 0.245 d1 5.2 ref 0.205 ref e 6.35 6.73 0.250 0.265 e1 5.3 ref 0.209 ref e1 3.96 5.18 0.156 0.204 h 9.398 10.41 0.370 0.410 l 0.51 0.020 l1 0.64 1.02 0.025 0.040 l2 0.89 2.032 0.035 0.080 l2 d l1 b b2 e c1 a h l c a1 e1 d1 e1
rev. b.13 - mar., 2004 hpl1117 15 ? copyright hipac semiconductor, inc. www.hipacsemi.com package information to-263 ( reference jedec registration to-263) e d l l2 l3 d1 e1 terminal 4 c a c2 r l1 l4 1 millimeters inches dim min. max. min. max. a 4.06 4.83 0.160 0.190 b 0.51 1.016 0.02 0.040 b2 1.14 1.651 0.045 0.065 c 0.38 typ. 0.015 typ. c2 1.14 1.40 0.045 0.055 d 8.64 9.65 0.340 0.380 e 9.65 10.54 0.380 0.415 e1 2.54 typ 0.100 typ l 14.60 15.88 0.575 0.625 l1 2.24 2.84 0.090 0.110 l2 1.02 2.92 0.040 0.112 l3 1.20 1.78 0.050 0.070
rev. b.13 - mar., 2004 hpl1117 16 ? copyright hipac semiconductor, inc. www.hipacsemi.com package information sot-223( reference jedec registration sot-223) b1 d h e k e e1 a c l a1 a b b millimeters inches dim min. max. min. max. a 1.50 1.80 0.06 0.07 a1 0.02 0.08 b 0.60 0.80 0.02 0.03 b1 2.90 3.10 0.11 0.12 c 0.28 0.32 0.01 0.01 d 6.30 6.70 0.25 0.26 e 3.30 3.70 0.13 0.15 e 2.3 bsc 0.09 bsc e1 4.6 bsc 0.18 bsc h 6.70 7.30 0.26 0.29 l 0.91 1.10 0.04 0.04 k 1.50 2.00 0.06 0.08
rev. b.13 - mar., 2004 hpl1117 17 copyright hipac semiconductor, inc. www.hipacsemi.com physical specifications terminal material solder-plated copper (solder material : 90/10 or 63/37 snpb lead solderability meets eia specification rsi86-91, ansi/j-std-002 category 3. packaging 2500 devices per reel t 25 c to peak tp ramp-up t l ramp-down ts preheat tsmax tsmin t l t p 25 temperature time critical zone t l to t p q reflow condition (ir/convection or vpr reflow) classificatin reflow profiles profile feature sn-pb eutectic assembly pb-free assembly large body small body large body small body average ramp-up rate (t l to t p ) 3 c/second max. 3 c/second max. preheat - temperature min (tsmin) - temperature mix (tsmax) - time (min to max)(ts) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds tsmax to t l - temperature(t l ) - time (t l ) 3 c/second max peak temperature(tp) 183 c 60-150 seconds 217 c 60-150 seconds time within 5 c of actual peak temperature(tp) 225 +0/-5 c 240 +0/-5 c 245 +0/-5 c 250 +0/-5 c ramp-down rate 10-30 seconds 10-30 seconds 10-30 seconds 20-40 seconds time 25 c to peak temperature 6 c/second max. 6 c/second max. 6 minutes max. 8 minutes max. note: all temperatures refer to topside of the package. measured on the body surface.
rev. b.13 - mar., 2004 hpl1117 18 ? copyright hipac semiconductor, inc. www.hipacsemi.com reliability test program test item method description solderability mil-std-883d-2003 245 carrier tape & reel dimension package reflow conditions pkg. thickness 2.5mm and all bgas pkg. thickness < 2.5mm and pkg. volume 350mm 3 pkg. thickness < 2.5mm and pkg. volume < 350mm 3 convection 220 +5/-0
rev. b.13 - mar., 2004 hpl1117 19 ? copyright hipac semiconductor, inc. www.hipacsemi.com application carrier width cover tape width devices per reel to- 252 16 13.3 2500 to- 263 24 21.3 1000 sot- 223 12 9.3 2500 cover tape dimensions a pp lica tio n a b c j t1 t2 w p e 330 1.75 0.1 f d d1 po p1 ao bo ko t to-252 7.5 a pp lica tio n a b c j t1 t2 w p e 380 to-263 11 .5 a pp lica tio n a b c j t1 t2 w p e 330 sot-223 5.5 carrier tape & reel dimension contact hipac semiconductor, inc. 2540 north first street, suite 308 san jose, ca 95131-1016 u.s.a. tel: 1-408-943-0808 fax: 1-408-943-0878 e-mail: info@hipacsemi.com

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